Heat dissipation molded body, manufacturing method of heat dissipation molded body, and configuration method of heat dissipation molded body.
TW202641328APending Publication Date: 2026-10-01SEKISUI CHEMICAL CO LTD +1
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Patent Information
- Application Number
- TW114151439
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-27
- Filing Date
- 2025-12-26
- Publication Date
- 2026-10-01
Smart Images
Figure TWG2TA001078901_001 
Figure TWG2TA001078901_002 
Figure TWG2TA001078901_003
Abstract
The present invention is a heat dissipation molded body, comprising: a top surface having a flat surface, a wall surface disposed on the outer periphery of the top surface, and a recess formed by the top surface and the wall surface; the top surface having: an outer surface opposite to the recess, and an inner surface on the side of the recess; the viscosity value T1 of the outer surface is less than the viscosity value T2 of the inner surface. none
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