Electronic devices and methods of manufacturing electronic devices

TW202641329APending Publication Date: 2026-10-01AMKOR TECH SINGAPORE HLDG PTE LTD
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Patent Information

Application Number
TW115102606
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-27
Filing Date
2026-01-22
Publication Date
2026-10-01

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    Figure TWG2TA001079158_003
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Abstract

In one example, an electronic device includes an electronic component. A thermal-interface-material-flow (TIM-flow) layer is disposed over the electronic component and on a sidewall of the electronic component. A thermal interface material (TIM) is disposed on the TIM-flow layer and around the sidewall of the electronic component. A lid is disposed over the TIM. The TIM fills a volume defined between the lid and the electronic component. An inner side of a top plate of the lid can be substantially devoid of TIM outside a footprint of the electronic component. Other examples and related methods are also disclosed herein.
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