Heat dissipation sheet and chip on film package structure

Abstract

A heat dissipation sheet including a heat dissipation lamination and an adhesive layer is provided. The heat dissipation lamination has a heat dissipation area and a connection area. The heat dissipation lamination includes a first heat dissipation metal layer and a second heat dissipation metal layer. The first heat dissipation metal layer includes a plurality of first protrusions arranged at intervals, and the first protrusions are located in the heat dissipation area. The second heat dissipation metal layer includes a plurality of second protrusions arranged at intervals, and the second protrusions are located in the heat dissipation area. At least a portion of the first protrusions contact the second heat dissipation metal layer, and at least a portion of the second protrusions contact the first heat dissipation metal layer. The adhesive layer is disposed on the heat dissipation lamination and located in the connection area. In addition, a chip on film package structure including the heat dissipation sheet is also mentioned.

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