Package substrate with a mold extension and die height equalization

Abstract

Embodiments disclosed herein include an apparatus that includes a substrate with a first surface and a second surface opposite from the first surface, where the first surface has a first flatness, a pillar over the first surface of the substrate, and a component over the first surface of the substrate. In an embodiment, a first layer is over the first surface of the substrate, where the first layer embeds the pillar and the component, and where a third surface of the first layer facing away from the substrate has a second flatness that is flatter than the first flatness. In an embodiment, a first die is over the first layer, where the first die is coupled to the pillar and the component, and a second die is over the first layer, where the second die is configured to be coupled to the pillar. In an embodiment, a second layer is over the first layer and around the first die and the second, and where backside surfaces of the first die and the second die are exposed.

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