Electronic devices and methods of manufacturing electronic devices

Abstract

In one example, an electronic device includes a substrate including a substrate top side, a substrate lower side, a dielectric structure, and a conductive structure, which includes substrate inner terminals adjacent to the substrate top side, and substrate outer terminals adjacent to the substrate lower side. An electronic component includes a first side coupled to the substrate inner terminals, a second side, and a lateral side. An interconnect module includes interconnects laterally spaced apart, each of the interconnects including a first lateral side, a second lateral side, a first end, and a second end; and a seed layer on the first lateral side. A package body covers the substrate top side, portions of the interconnect module and the lateral side of the electronic component. The first end of each of the interconnects is coupled to the substrate inner terminals. Other examples and related methods are also disclosed herein.

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