Power device package

TW202641348APending Publication Date: 2026-10-01GANRICH SEMICON CORP
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Patent Information

Application Number
TW114111105
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-25
Publication Date
2026-10-01

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Abstract

A power device package including: a frame base island; a power device disposed on the frame base island; a molding compound encapsulating the frame base island and the power device; a drain pin extending outward from one side of the frame base island and protruding from the molding compound; a gate pin located on one side of the drain pin, extending and protruding from the molding compound; a source pin located on the other side of the drain pin relative to the gate pin, extending and protruding from the molding compound; and a transfer board device mounted on the frame base island.
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