Electronic modules and methods for manufacturing electronic modules

TW202641349APending Publication Date: 2026-10-01SHINDENGEN ELECTRIC MANUFACTURING CO LTD
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Patent Information

Application Number
TW115108285
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-27
Filing Date
2026-03-06
Publication Date
2026-10-01

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Abstract

The electronic module of the present invention includes: a substrate; electronic components disposed on the substrate; an external lead frame disposed above the substrate and spaced apart from the substrate, with its ends forming external terminals; and an internal lead frame disposed between the substrate and the external lead frame. The thickness of the internal lead frame is less than the thickness of the external lead frame. According to the electronic module of the present invention, fine internal wiring can be formed using the lead frame.
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