Package structure and methods for manufacturing the same

TW202641352APending Publication Date: 2026-10-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Application Number
TW114117313
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-21
Filing Date
2025-05-08
Publication Date
2026-10-01

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    Figure TWG2TA001078121_003
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Abstract

A package structure includes a package substrate, a package module on the package substrate including a first encapsulant layer, an active die in the first encapsulant layer, wherein the active die includes a first area with a first power density and a second area with a second power density and the first power density is greater than the second power density. The package module may further include a dummy die over the first area of the active die, and the package structure may further include a second encapsulant layer on the package substrate around the package module.
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