Semiconductor package and manufacturing method thereof
TW202641353APending Publication Date: 2026-10-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Application Number
- TW114117945
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-27
- Filing Date
- 2025-05-13
- Publication Date
- 2026-10-01
Smart Images
Figure TWG2TA001078130_001 
Figure TWG2TA001078130_002 
Figure TWG2TA001078130_003
Abstract
A method for forming a package structure and the package structure formed therefrom are described. The structure includes a first die, a second die, a third die and a filling material. The second and third dies are stacked on and bonded with the first die. The filling material is disposed on the first die and filled between the second and third dies. The first die, the second die and the third die are electrically connected and bonded, sidewalls of the first die are revealed, and at least one sidewall of the second die and at least one sidewall of the third die are revealed.
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