Electronic devices and methods of manufacturing electronic devices
TW202641362APending Publication Date: 2026-10-01AMKOR TECH SINGAPORE HLDG PTE LTD
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Patent Information
- Application Number
- TW115125164
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2019-12-09
- Filing Date
- 2020-12-01
- Publication Date
- 2026-10-01
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Abstract
In one example, an electronic device includes: an electronic component comprising a sensor and an electrical interconnect; a substrate comprising an electrically conductive material and a translucent mold compound, wherein the electrically conductive material is coupled to the translucent mold compound and wherein the electrical interconnect of the electronic component is coupled to the electrically conductive material of the substrate; and a translucent underfill contacting the electrical interconnect and between the translucent mold compound and the sensor. Other examples and related methods are also disclosed herein.
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