Stacked integrated circuit device including a stiffener die

Abstract

A package includes a first die, a second die, and a third die. The first die includes first active circuitry, and a first plurality of conductive vias (CVs) that has a first pitch. The second die includes second active circuitry proximate to a first side of the second die. The second active circuitry includes metal layers and a second plurality of CVs that extends from a second side of the second die to one or more of the metal layers. The second plurality of CVs has a second pitch greater than the first pitch. The third die includes a third plurality of CVs to electrically couple the second active circuitry to a substrate. The third plurality of CVs has a third pitch greater than the first pitch. The second die is disposed between the first die and the third die.

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