Electronic module

Abstract

The electronic module of the present invention comprises: a substrate having a power wiring portion; a plurality of semiconductor elements arranged side-by-side on the substrate and having gate electrode portions formed on their surfaces; a signal substrate disposed on the substrate and having an insulating substrate and gate wiring portions formed on the surface of the insulating substrate; and gate pin terminals erected on the gate wiring portions. The wiring length from the gate pin terminals to the gate electrode portions of each semiconductor element is equal. According to the electronic module of the present invention, inductance can be reduced, and even when semiconductor elements are connected in parallel, switching timing can be kept consistent.

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