Joining device and joining method

Abstract

The present invention addresses the problem of providing a technique to increase the throughput of a bonding apparatus. As a solution to the aforementioned problem, the bonding apparatus of the present invention aligns the die and the substrate based on the relative positions of a first mark on the die and a second mark on the substrate, thereby bonding the die and the substrate. The bonding apparatus includes a planar linear motor and a control circuit. The planar linear motor has: a stator having a plane; and a plurality of rotors that move in two directions parallel to and intersecting the plane, with a gap formed between them and the plane of the stator. A second adsorption head is disposed on one rotor, and a first detection unit is disposed on another rotor. The control circuit individually controls the position of the plurality of rotors.

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