Semiconductor device and method of manufacturing a semiconductor device
TW202641374APending Publication Date: 2026-10-01AMKOR TECH SINGAPORE HLDG PTE LTD
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Patent Information
- Application Number
- TW115124271
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2019-05-28
- Filing Date
- 2020-03-20
- Publication Date
- 2026-10-01
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Abstract
In one example, a semiconductor device comprises a base assembly comprising a first substrate, a first device on a top surface of the first substrate, and a first encapsulant on the top surface of the first substrate and bounding a side surface of the first device. The semiconductor device further comprises a conductive pillar on the first substrate and in the first molding compound, wherein the conductive pillar comprises a non-conductive pillar core and a conductive pillar shell on the pillar core.
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