Bond wires and wirebonding methods

TW202641380APending Publication Date: 2026-10-01SEMICON COMPONENTS IND LLC
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Patent Information

Application Number
TW114130954
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-17
Filing Date
2025-08-14
Publication Date
2026-10-01

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Abstract

Implementations of a method of wirebonding may include providing a bond wire; forming a first wirebond on a surface of a substrate using a bond head and lifting the bond head away from the bond wire a predetermined distance, causing the bond wire to lift from the surface of the substrate. The method may include cutting the bond wire and forming a second wirebond on the surface of the substrate using the bond head.
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