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TW202641390APending Publication Date: 2026-10-01GANRICH SEMICON CORP
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Patent Information

Application Number
TW114111194
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-25
Publication Date
2026-10-01

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  • Figure TWG2TA001077814_001
    Figure TWG2TA001077814_001
  • Figure TWG2TA001077814_002
    Figure TWG2TA001077814_002
  • Figure TWG2TA001077814_003
    Figure TWG2TA001077814_003
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Abstract

A package includes a package bottom. The package bottom includes a lead frame and a molding compound. The lead frame includes a source electrode, a drain electrode, and a first gate electrode. The molding compound covers the lead frame and exposes the back of the source electrode, the back of the drain electrode, and the back of the first gate electrode. The source electrode forms a first T-shape. The first T-shape includes a first beam and a first column. The first gate electrode is disposed at a first corner defined by the first beam and the first column, while the drain electrode is disposed at one side of the first beam.
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