Substrate processing method and substrate processing apparatus

Abstract

This invention relates to a substrate processing method for filling the gaps in the peripheral portion of a multilayer substrate Ws formed by stacking multiple substrates with a filler, and includes: a first transmission image acquisition step S2, which acquires a first transmission image of the peripheral portion P of the multilayer substrate Ws; a filling step S3, which fills the gaps G in the peripheral portion P of the multilayer substrate Ws after acquiring the first transmission image with a filler; a second transmission image acquisition step S5, which acquires a second transmission image of the peripheral portion P after filling with the filler; and a determination step S6, which compares the first transmission image and the second transmission image to determine the filling state of the filler.

Images