Cutting machining apparatus
TW202641462APending Publication Date: 2026-10-16KANAZAWA UNIV
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Patent Information
- Application Number
- TW115106492
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-25
- Filing Date
- 2026-02-24
- Publication Date
- 2026-10-16
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Abstract
An object of the present invention is to provide a cutting machining apparatus capable of suppressing an increase in size. The cutting machining apparatus includes: a cutting device that cuts a workpiece by rotation of a tool; a holding device that holds the workpiece; a moving device that relatively moves the tool and the workpiece in an extending direction of a rotation axis of the tool; and a control device that controls the cutting device, the holding device, and the moving device to cut the workpiece along a spiral machining path. The cutting device includes: a spindle that rotationally drives the tool; and a tool swinging device that swings at least the tool around a first axis parallel to the rotation axis. The holding device includes a workpiece rotating device that is provided independently of the tool swinging device and rotates the workpiece around a second axis parallel to the first axis.
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