Dispensing mechanism, dispensing valve replacement method and dispensing valve replacement system

TW202641637APending Publication Date: 2026-10-16HON HAI PRECISION INDUSTRY CO LTD
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Patent Information

Application Number
TW114116845
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-14
Filing Date
2025-05-05
Publication Date
2026-10-16

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    Figure TWG2TA001080418_003
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Abstract

This application provides a dispensing mechanism, a dispensing valve replacement method and a dispensing valve replacement system. The dispensing mechanism includes: a frame; a carrying component, which is arranged on the frame; a first connecting part, which is arranged on the carrying component; a dispensing valve component, which includes a dispensing valve, a glue cylinder, a liquid level sensor and a second connecting part. The glue cylinder is arranged on the dispensing valve. The liquid level sensor is arranged on the glue cylinder, and is used for detecting whether the liquid level of the glue in the glue cylinder is lower than a preset position. The second connecting part is arranged on the dispensing valve, and the second connecting part is separably connected to the first connecting part. The carrying component is used for driving the first connecting part and the second connecting part to connect or separate. The dispensing mechanism of the application realizes the automatic replacement of the glue cylinder, and improves the replacement efficiency of the glue cylinder, thereby improving the production efficiency.
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