Heating apparatus and method for manufacturing solder-joined object

Abstract

A heating apparatus includes a support member that supports an object to be heated, and a heater that heats the object supported by the support member or the support member supporting the object. The heater includes a plurality of annular heating elements. Each heating element has a different circumferential length and is arranged in a nested manner and is capable of outputting a different amount of heat and of changing the amount of heat to be output. A method for manufacturing a solder-joined object, which uses the heating apparatus, includes supplying the object to the support member, causing the heating elements to generate heat to raise the temperature of the object to a first predetermined temperature, changing an output ratio of the heating elements to maintain the first predetermined temperature, supplying a reducing gas, and increasing the outputs of the heating elements to raise the temperature to a second predetermined temperature to perform solder joining.

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