Encapsulation using ultrasonic welding

Abstract

A distribution arrangement receives and distributes the core material onto the first substrate. A pair of ultrasonic welding devices, at least one of which is driven as a sonotrode to transmit ultrasonic vibrations, receive the substrates through a gap between them. At least one of the devices has a surface patterned with recessed cells enclosed by a substantially continuous border. The vibrations cause the core material to oscillate between the substrates and cause ultrasonic welding. The patterned surface drives and directs movement of the oscillating core material into regions corresponding to the recessed cells and determines an ultrasonic welding pattern such that the substrates are welded along substantially continuous joints corresponding to the border, entrapping the core material in pockets corresponding to the cells.

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