Circuit board laser cutting equipment and operating method thereof

Abstract

A circuit board laser etching apparatus is provided for laser etching printed circuit boards. The laser module of the circuit board laser etching apparatus includes a first laser element, a second laser element, and a third laser element. The first and second laser elements emit a first laser beam and a second laser beam, respectively, onto the printed circuit board to laser etch the solder resist layer. After the solder resist layer is etched by the first and second laser beams to form a rectangular opening, the surface of the copper circuit layer is exposed through the rectangular opening, and the side length of the rectangular opening is between 0.025 mm and 0.1 mm. The third laser element emits a third laser beam onto the printed circuit board to laser etch the copper circuit layer through the rectangular opening. The wavelength of the first laser beam is between 9 µm and 11 µm, the wavelength of the second laser beam is between 800 nm and 1500 nm, and the wavelength of the third laser beam is between 200 nm and 400 nm.

Description

Technical Field

[0001] This disclosure relates to a laser etching apparatus and its operating method, and more particularly to an apparatus that replaces the traditional wet etching process with a laser module to reduce the machine cost of the traditional wet etching equipment, and to improve the laser etching apparatus and operating method for circuit boards where there is a size difference between the required exposure pattern and the exposure pattern formed by the exposure machine. Prior Technology

[0002] Generally, wet etching processes using equipment such as exposure machines and developing machines are employed to remove a portion of the solder mask on printed circuit boards (PCBs), exposing the underlying copper traces for subsequent chemical processing. However, with the shrinking size of electronic components, PCBs may experience exposure rejection during the exposure process. In other words, due to the continuous reduction in component size, the size of the exposure pattern on the PCB is physically limited, resulting in a size discrepancy between the required exposure pattern and the pattern formed by the exposure machine. This leads to reduced accuracy in subsequent processes. Furthermore, the use of wet etching equipment increases the equipment costs for PCB manufacturing, and the chemical wastewater generated during production requires additional treatment costs, further increasing the overall production cost of PCBs. Summary of the Invention

[0003] One of the technical embodiments disclosed herein is a circuit board laser etching equipment, which replaces the equipment of the traditional wet etching process with a laser module, thereby reducing the machine cost of the traditional wet etching equipment and improving the situation where there is a size difference between the required exposure pattern and the exposure pattern formed by the exposure machine, thus improving the application value of the circuit board laser etching equipment.

[0004] This disclosure provides a circuit board laser etching apparatus for laser etching printed circuit boards. The printed circuit board has a copper layer and a solder resist layer covering the copper layer. The circuit board laser etching apparatus includes a platform and a laser module. The platform is used to mount the printed circuit board. The laser module is disposed above the platform and includes a first laser element, a second laser element, and a third laser element. The first laser element emits a first laser beam to the printed circuit board to laser etch the solder resist layer. The second laser element is disposed on one side of the first laser element and emits a second laser beam to the printed circuit board to laser etch the solder resist layer. After the solder resist layer is etched by the first and second laser beams to form a rectangular opening, the surface of the copper layer of the printed circuit board is exposed through the rectangular opening. The wavelength of the first laser beam is different from the wavelength of the second laser beam, and the side length of the rectangular opening is between 0.025 mm and 0.1 mm. A third laser element is disposed on one side of the first laser element and is used to emit a third laser beam onto the printed circuit board to etch the copper layer of the circuit via a rectangular aperture laser. The wavelength of the third laser beam is smaller than the wavelengths of the first laser beam and the second laser beam. The wavelength of the first laser beam emitted by the first laser element is between 9µm and 11µm, the wavelength of the second laser beam emitted by the second laser element is between 800nm ​​and 1500nm, and the wavelength of the third laser beam emitted by the third laser element is between 200nm and 400nm.

[0005] According to one embodiment of this disclosure, the aforementioned circuit board laser etching apparatus further includes a detection module. The detection module is disposed on one side of the laser module and has a detection lens. After the third laser emits a third laser beam onto the printed circuit board to laser etch the copper layer of the circuit through a rectangular opening, the detection lens of the detection module is used to detect whether any solder resist layer remains on the copper layer of the circuit in the rectangular opening.

[0006] According to one embodiment of this disclosure, the first laser element is a carbon dioxide laser, and the first wavelength of the first laser beam emitted by the first laser element is 10.6µm; the second laser element is an infrared laser, and the second wavelength of the second laser beam emitted by the second laser element is 1064nm; the third laser element is an ultraviolet laser, and the third wavelength of the third laser beam emitted by the third laser element is 355nm; and the laser spots of the first laser beam, the second laser beam, and the third laser beam are between 0.02µm and 0.03µm.

[0007] According to one embodiment of the present disclosure, the surface of the copper layer of the printed circuit board is curved and has recesses, and a portion of the solder resist layer remains in the recesses. A third laser element is used to emit a third laser beam to the printed circuit board to laser etch the copper layer of the circuit through a rectangular opening and remove the solder resist layer remaining in the recesses.

[0008] According to one embodiment of this disclosure, the surface of the copper layer of the circuit etched by the third laser beam is curved or the surface of the copper layer of the circuit etched by the third laser beam is flush.

[0009] Another embodiment of this disclosure is an operation method of a circuit board laser etching equipment, which replaces the equipment of the traditional wet etching process with a laser module to reduce the machine cost of the traditional wet etching equipment and improve the situation where there is a size difference between the required exposure pattern and the exposure pattern formed by the exposure machine, thereby improving the application value of the circuit board laser etching equipment.

[0010] This disclosure provides an operating method for a circuit board laser etching apparatus. The operating method is used to laser-etch a printed circuit board (PCB) having a copper trace layer and a solder resist layer covering the copper trace layer. The operating method includes: placing the PCB on a support stage; emitting a first laser beam from a first laser element of a laser module onto the PCB to laser-etch the solder resist layer; and emitting a second laser beam from a second laser element of the laser module onto the PCB to laser-etch the solder resist layer. After the solder resist layer is etched by the first and second laser beams to form a rectangular opening, the surface of the copper trace layer of the PCB is exposed through the rectangular opening. The first wavelength of the first laser beam is different from the second wavelength of the second laser beam, and the side length of the rectangular opening is less than 0.0 mm. The wavelength of the laser beam is between 25 mm and 0.1 mm; and a third laser beam is emitted by a third laser element of the laser module to the printed circuit board to laser etch the copper layer of the circuit through a rectangular aperture, wherein the third wavelength of the third laser beam is less than the first wavelength of the first laser beam and the second wavelength of the second laser beam, the first wavelength of the first laser beam emitted by the first laser element is between 9 µm and 11 µm, the second wavelength of the second laser beam emitted by the second laser element is between 800 nm and 1500 nm, and the third wavelength of the third laser beam emitted by the third laser element is between 200 nm and 400 nm.

[0011] According to one embodiment of the present disclosure, the operation method of the above-mentioned circuit board laser etching equipment further includes: after the third laser emits a third laser beam to the printed circuit board to laser etch the copper layer of the circuit through a rectangular opening, the detection lens of a detection module detects whether there is a residual solder resist layer on the copper layer of the circuit in the rectangular opening.

[0012] According to one embodiment of this disclosure, the first laser element is a carbon dioxide laser, and the first wavelength of the first laser beam emitted by the first laser element is 10.6µm; the second laser element is an infrared laser, and the second wavelength of the second laser beam emitted by the second laser element is 1064nm; the third laser element is an ultraviolet laser, and the third wavelength of the third laser beam emitted by the third laser element is 355nm; and the laser spots of the first laser beam, the second laser beam, and the third laser beam are between 0.02µm and 0.03µm.

[0013] According to one embodiment of the present disclosure, the surface of the copper layer of the printed circuit board is curved and has recesses, and a portion of the solder resist layer remains in the recesses. The emission of a third laser beam by a third laser element of the laser module further includes: the third laser element emitting a third laser beam to the printed circuit board to laser etch the copper layer of the circuit through a rectangular opening and remove the solder resist layer remaining in the recesses.

[0014] According to one embodiment of this disclosure, the surface of the copper layer of the circuit etched by the third laser beam is curved or the surface of the copper layer of the circuit etched by the third laser beam is flush.

[0015] In summary, the laser module of the circuit board laser etching equipment disclosed herein can replace traditional wet etching equipment. It uses a first laser, a second laser, and a third laser to laser-etch the solder resist layer and the copper layer of the printed circuit board. Specifically, the first and second lasers emit first and second laser beams respectively to the printed circuit board to laser-etch the solder resist layer, and the third laser emits a third laser beam to the printed circuit board to laser-etch the copper layer through a rectangular aperture. This configuration of using a laser module for dry etching of the printed circuit board reduces the equipment cost compared to traditional wet etching equipment. Furthermore, even as component sizes continue to shrink, the high precision of the laser module improves the situation where there is a size discrepancy between the required exposure pattern and the exposure pattern formed by the exposure machine. This allows the printed circuit board to be used in high-precision electronic products, thereby enhancing the application value of the circuit board laser etching equipment. Simple Explanation of the Diagram

[0016] One embodiment of this disclosure is best understood when read in conjunction with the accompanying figures, from the following detailed description. It should be emphasized that, according to standard industrial practice, the various features are not drawn to scale and are for illustrative purposes only. In fact, the dimensions of the various features may be arbitrarily increased or decreased for clarity of explanation. Figure 1 shows a block diagram of a circuit board laser etching apparatus according to one embodiment of the present disclosure. Figure 2 illustrates a flowchart of an operation method of a circuit board laser etching apparatus according to an embodiment of the present disclosure. Figures 3 to 5 illustrate cross-sectional views of the operation of a circuit board laser etching apparatus according to some embodiments of the present disclosure at different stages. Figure 6 illustrates a top view of a solder resist layer etched by a first laser beam and a second laser beam to form a rectangular opening according to an embodiment of the present disclosure. Figure 7 illustrates a cross-sectional view of a line copper layer laser-etched by a third laser beam according to an embodiment of this disclosure, showing that the line surface is flush. Figure 8 illustrates a cross-sectional view of a curved copper layer of a circuit etched by a third laser beam according to another embodiment of this disclosure. Implementation

[0017] The following disclosure of embodiments provides many different implementations, or examples, for carrying out different features of the provided object. Specific examples of elements and arrangements are described below to simplify the subject matter. Of course, these examples are merely illustrative and are not intended to be limiting. Furthermore, element symbols and / or letters may be repeated in various examples. This repetition is for simplicity and clarity and does not in itself specify the relationship between the various embodiments and / or configurations discussed.

[0018] Spatial relative terms such as “below,” “under,” “lower,” “above,” and “upper” are used herein for descriptive purposes to describe the relationship between one element or feature and another, as shown in the accompanying drawings. Spatial relative terms are intended to cover different orientations of the device in use or operation other than those shown in the accompanying drawings. The device may be oriented in other ways (rotated 90 degrees or otherwise), and the spatial relative descriptors used herein shall be interpreted accordingly.

[0019] Please refer to Figure 1, which is a block diagram of a circuit board laser etching apparatus 100 according to an embodiment of the present disclosure. In Figure 1, the circuit board laser etching apparatus 100 includes a support stage 110 and a laser module 120. The laser module 120 is disposed above the support stage 110 and includes a first laser element 122, a second laser element 124, and a third laser element 126. The second laser element 124 of the laser module 120 may be disposed on one side of the first laser element 122, and the third laser element 126 of the laser module 120 may be disposed on one side of the first laser element 122. Furthermore, the circuit board laser etching apparatus 100 further includes a detection module 130. The detection module 130 is disposed on one side of the laser module 120 and has a detection lens 132.

[0020] The following description will explain the operation of the circuit board laser etching equipment. The component connections, materials, and functions already described will not be repeated, but will be stated in advance.

[0021] Please refer to Figure 2, which illustrates a flowchart of an operation method of a circuit board laser etching apparatus according to an embodiment of the present disclosure. In Figure 2, the operation method of the circuit board laser etching apparatus includes the following steps: First, in step S1, a printed circuit board is placed on a support stage. Next, in step S2, a first laser beam is emitted from the first laser element of the laser module onto the printed circuit board to laser etch the solder resist layer. Next, in step S3, a second laser beam is emitted from the second laser element of the laser module onto the printed circuit board to laser etch the solder resist layer. After the solder resist layer is etched by the first and second laser beams to form a rectangular opening, the surface of the copper layer of the printed circuit board is exposed through the rectangular opening. The first wavelength of the first laser beam is different from the second wavelength of the second laser beam, and the side length of the rectangular opening is between 0.025 mm and 0.1 mm. Next, in step S4, a third laser beam is emitted from the third laser element of the laser module onto the printed circuit board to etch the copper layer of the circuit via a rectangular aperture laser. The third wavelength of the third laser beam is smaller than the first wavelength of the first laser beam and the second wavelength of the second laser beam. The first wavelength of the first laser beam emitted by the first laser element is between 9µm and 11µm, the second wavelength of the second laser beam emitted by the second laser element is between 800nm ​​and 1500nm, and the third wavelength of the third laser beam emitted by the third laser element is between 200nm and 400nm. The above steps will be described in detail below.

[0022] Please refer to Figures 3 to 6. Figures 3 to 5 show cross-sectional views of the operation method of the circuit board laser etching apparatus according to some embodiments of the present disclosure at different stages. Figure 6 shows a top view of a solder resist layer 220 formed into a rectangular opening 230 by etching with a first laser beam L1 and a second laser beam L2 according to an embodiment of the present disclosure. In Figures 3 to 6, the circuit board laser etching apparatus 100 is used to perform laser etching on a printed circuit board 200. The printed circuit board 200 has a copper circuit layer 210 and a solder resist layer 220 covering the copper circuit layer 210. A support stage 110 is used for placing the printed circuit board 200 thereon. The first laser element 122 of the laser module 120 is used to emit a first laser beam L1 to the printed circuit board 200 to laser etch the solder resist layer 220. The second laser element 124 of the laser module 120 is used to emit a second laser beam L2 to the printed circuit board 200 to laser etch the solder resist layer 220. After the solder resist layer 220 is etched by the first laser beam L1 and the second laser beam L2 to form a rectangular opening 230, the circuit surface 212 of the circuit copper layer 210 of the printed circuit board 200 is exposed through the rectangular opening 230. The first wavelength of the first laser beam L1 is different from the second wavelength of the second laser beam L2, and the side length of the rectangular opening 230 is between 0.025 mm and 0.1 mm.

[0023] In some embodiments, the surface 212 of the copper layer 210 of the printed circuit board 200 is curved and has recesses 214, and a portion of the solder mask 220 remains in the recesses 214. The first laser element 122 of the laser module 120 emits a first laser beam L1 with a first wavelength between 9µm and 11µm, and the second laser element 124 of the laser module 120 emits a second laser beam L2 with a second wavelength between 800nm ​​and 1500nm. Specifically, the first laser element 122 of the laser module 120 is a carbon dioxide laser, and the first wavelength of the first laser beam L1 emitted by the first laser element 122 of the laser module 120 is 10.6µm. The second laser element 124 of the laser module 120 is an infrared laser, and the second wavelength of the second laser beam L2 emitted by the second laser element 124 of the laser module 120 is 1064nm.

[0024] Please refer to Figure 7, which shows a flush cross-sectional view of the copper layer 210 etched by laser with a third laser beam L3 according to an embodiment of this disclosure. In Figures 5 to 7, the third laser element 126 of the laser module 120 emits a third laser beam L3 to the printed circuit board 200 to laser etch the copper layer 210 through a rectangular opening 230. The third wavelength of the third laser beam L3 emitted by the third laser element 126 is less than the first wavelength of the first laser beam L1 and the second wavelength of the second laser beam L2. The third wavelength of the third laser beam L3 emitted by the third laser element 126 is between 200 nm and 400 nm. Specifically, the third laser element 126 of the laser module 120 is an ultraviolet laser, and the third wavelength of the third laser beam L3 emitted by the third laser element 126 of the laser module 120 is 355 nm. The laser beams L1, L2, and L3 emitted by the first laser element 122, the second laser element 124, and the third laser element 126 of the laser module 120 have laser spots between 0.02µm and 0.03µm, specifically 0.025µm.

[0025] In some embodiments, the surface 212 of the copper layer 210 of the printed circuit board 200 is curved and has recesses 214, and a portion of the solder resist 220 remains in the recesses 214. The third laser element 126 of the laser module 120 is further used to emit a third laser beam L3 to the printed circuit board 200 to laser etch the copper layer 210 through the rectangular opening 230 and remove the solder resist 220 remaining in the recesses 214. In addition, after the third laser element 126 emits the third laser beam L3 to the printed circuit board 200 to laser etch the copper layer 210 through the rectangular opening 230, the detection lens 132 of the detection module 130 (see FIG. 1) is used to detect whether the solder resist 220 remains on the copper layer 210 in the rectangular opening 230. Furthermore, the surface 212 of the copper layer 210 etched by the third laser beam L3 is flush, which improves the effect of subsequent processes such as surface treatment and wire bonding. For example, during the electroless gold plating process, the absence of residual solder resist 220 on the copper layer 210 facilitates the complete formation of the electroless gold plating layer on the copper layer 210, achieving a pull strength of 12.66 grams and a push strength of 54.3 grams.

[0026] Please refer to Figure 8, which shows a curved cross-sectional view of the copper layer 210a laser-etched by a third laser beam L3 according to another embodiment of this disclosure. The embodiment shown in Figure 8 differs from the embodiment shown in Figure 7 in that the copper layer 210a laser-etched by the third laser beam L3 has a curved surface 212a. Although the surface 212a of the copper layer 210a is curved, no solder resist 220 remains on it. For example, the absence of solder resist 220 on the copper layer 210a facilitates the complete formation of the gold plating layer on the copper layer 210a, achieving a tensile strength of 12.66 grams and a push strength of 54.3 grams.

[0027] In summary, the laser module 120 of the circuit board laser etching equipment 100 can replace the equipment for traditional wet etching processes. The first laser element 122, the second laser element 124, and the third laser element 126 perform laser etching on the solder resist layer 220 and the copper layer 210 of the printed circuit board 200. Specifically, the first laser element 122 and the second laser element 124 of the laser module 120 can respectively emit a first laser beam L1 and a second laser beam L2 to the printed circuit board 200 to laser etch the solder resist layer 220, and the third laser element 126 of the laser module 120 can emit a third laser beam L3 to the printed circuit board 200 to laser etch the copper layer 210 through a rectangular opening 230. By configuring the laser module 120 to perform a dry etching process on the printed circuit board 200, the machine cost of traditional wet etching equipment can be reduced. Furthermore, even as component sizes continue to shrink, the high precision of the laser module 120 can improve the situation where there is a size discrepancy between the required exposure pattern and the exposure pattern formed by the exposure machine, thereby enabling the printed circuit board 200 to be used in high-precision electronic products and enhancing the application value of the circuit board laser etching equipment 100.

[0028] The foregoing outlines the features of several embodiments, enabling those skilled in the art to better understand the nature of this disclosure. Those skilled in the art should understand that they can readily use this disclosure as the basis for designing or modifying other processes and structures to achieve the same objectives and / or advantages as the embodiments described herein. Those skilled in the art should also recognize that such equivalent constructions do not depart from the spirit and scope of this disclosure, and that various changes, substitutions, and alterations can be made to them without departing from the spirit and scope of this disclosure.

[0029] 100: Circuit Board Laser Etching Equipment 110: Support Platform 120: Laser Module 122: First laser component 124: Second laser component 126: Third laser component 130: Detection Module 132: Inspection Lens 200: Printed Circuit Board 210, 210a: Copper layer of circuit 212, 212a: Line surface 214: Hole 220: Solder resist layer 230: Rectangular opening L1: First laser beam L2: Second laser beam L3: Third Laser Beam S1: Steps S2: Steps S3: Steps S4: Steps

Claims

1. A circuit board laser etching apparatus for laser etching a printed circuit board (200), wherein the printed circuit board (200) has a copper line layer (210) and a solder resist layer (220) covering the copper line layer (210), and the circuit board laser etching apparatus comprises: A support platform (110) is provided for mounting the printed circuit board (200); And a laser module (120) is disposed above the support platform (110) and includes: a first laser element (122) for emitting a first laser beam (L1) to the printed circuit board (200) to laser etch the solder resist layer (220); A second laser element (124) is disposed on one side of the first laser element (122) and is used to emit a second laser beam (L2) to the printed circuit board (200) to laser etch the solder resist layer (220). After the solder resist layer (220) is etched by the first laser beam (L1) and the second laser beam (L2) to form a rectangular opening (230), a circuit surface (212) of the circuit copper layer (210) of the printed circuit board (200) is exposed through the rectangular opening (230). A first wavelength of the first laser beam (L1) is different from a second wavelength of the second laser beam (L2), and the side length of the rectangular opening (230) is between 0.025 mm and 0.1 mm. A third laser element (126) is disposed on the... One side of the first laser element (122) is used to emit a third laser beam (L3) to the printed circuit board (200) to laser etch the copper layer (210) of the circuit through the rectangular opening (230), wherein a third wavelength of the third laser beam (L3) is smaller than the first wavelength of the first laser beam (L1) and the second wavelength of the second laser beam (L2). The first wavelength of the first laser beam (L1) emitted by the first laser element (122) is between 9µm and 11µm, the second wavelength of the second laser beam (L2) emitted by the second laser element (124) is between 800nm ​​and 1500nm, and the third wavelength of the third laser beam (L3) emitted by the third laser element (126) is between 200nm and 400nm.

2. The circuit board laser etching apparatus as described in claim 1, further comprising: A detection module (130) is disposed on one side of the laser module (120) and has a detection lens (132). After the third laser element (126) emits the third laser beam (L3) to the printed circuit board (200) to laser etch the copper layer (210) of the line through the rectangular opening (230), the detection lens (132) of the detection module (130) is used to detect whether the solder resist layer (220) remains on the copper layer (210) of the line in the rectangular opening (230).

3. The circuit board laser etching apparatus as claimed in claim 1, wherein the first laser element (122) is a carbon dioxide laser, and the first wavelength of the first laser beam (L1) emitted by the first laser element (122) is 10.6µm, the second laser element (124) is an infrared laser, and the second wavelength of the second laser beam (L2) emitted by the second laser element (124) is 1064nm, the third laser element (126) is an ultraviolet laser, and the third wavelength of the third laser beam (L3) emitted by the third laser element (126) is 355nm, and the laser spots of the first laser beam (L1), the second laser beam (L2) and the third laser beam (L3) are between 0.02µm and 0.03µm.

4. The circuit board laser etching apparatus as claimed in claim 1, wherein the circuit surface (212) of the circuit copper layer (210) of the printed circuit board (200) is curved and has a recess (214), and a portion of the solder resist (220) remains in the recess (214), wherein the third laser element (126) is further used to emit the third laser beam (L3) to the printed circuit board (200) to laser etch the circuit copper layer (210) through the rectangular opening (230) and remove the solder resist (220) remaining in the recess (214).

5. The circuit board laser etching apparatus as claimed in claim 1, wherein the circuit surface (212a) of the circuit copper layer (210a) laser-etched by the third laser beam (L3) is curved or the circuit surface (212) of the circuit copper layer (210) laser-etched by the third laser beam (L3) is flush.

6. A method of operating a circuit board laser etching apparatus for laser etching a printed circuit board (200), wherein the printed circuit board (200) has a copper line layer (210) and a solder resist layer (220) covering the copper line layer (210), and the method of operating the circuit board laser etching apparatus includes: The printed circuit board (200) is placed on a support platform (110); A first laser beam (L1) is emitted from a first laser element (122) of a laser module (120) onto the printed circuit board (200) to laser etch the solder resist layer (220); A second laser beam (L2) is emitted from a second laser element (124) of the laser module (120) onto the printed circuit board (200) to laser etch the solder resist layer (220). After the solder resist layer (220) is etched by the first laser beam (L1) and the second laser beam (L2) to form a rectangular opening (230), a circuit surface (212) of the copper layer (210) of the printed circuit board (200) is exposed through the rectangular opening (230). A first wavelength of the first laser beam (L1) is different from a second wavelength of the second laser beam (L2), and the side length of the rectangular opening (230) is between 0.025 mm and 0.1 mm. A third laser element (124) of the laser module (120) emits a second laser beam (L2) onto the printed circuit board (200) to laser etch the solder resist layer (220). A laser element (126) emits a third laser beam (L3) onto the printed circuit board (200) to laser etch the copper layer (210) of the circuit through the rectangular opening (230). The third wavelength of the third laser beam (L3) is smaller than the first wavelength of the first laser beam (L1) and the second wavelength of the second laser beam (L2). The first wavelength of the first laser beam (L1) emitted by the first laser element (122) is between 9µm and 11µm. The second wavelength of the second laser beam (L2) emitted by the second laser element (124) is between 800nm ​​and 1500nm. The third wavelength of the third laser beam (L3) emitted by the third laser element (126) is between 200nm and 400nm.

7. The method of operating the circuit board laser etching equipment as described in claim 6 further includes: After the third laser element (126) emits the third laser beam (L3) to the printed circuit board (200) to laser etch the copper layer (210) of the line through the rectangular opening (230), the detection lens (132) of the detection module (130) detects whether the solder resist layer (220) remains on the copper layer (210) of the line in the rectangular opening (230).

8. A method of operating the circuit board laser etching apparatus as described in claim 6, wherein the first laser element (122) is a carbon dioxide laser, and the first wavelength of the first laser beam (L1) emitted by the first laser element (122) is 10.6µm, the second laser element (124) is an infrared laser, and the second wavelength of the second laser beam (L2) emitted by the second laser element (124) is 1064nm, the third laser element (126) is an ultraviolet laser, and the third wavelength of the third laser beam (L3) emitted by the third laser element (126) is 355nm, and the laser spots of the first laser beam (L1), the second laser beam (L2) and the third laser beam (L3) are between 0.02µm and 0.03µm.

9. A method of operating a circuit board laser etching apparatus as claimed in claim 6, wherein the surface (212) of the circuit copper layer (210) of the printed circuit board (200) is curved and has a recess (214), and a portion of the solder resist layer (220) remains in the recess (214), and the third laser beam (L3) is emitted by the third laser element (126) of the laser module (120) further comprises: The third laser element (126) emits the third laser beam (L3) to the printed circuit board (200) to laser etch the copper layer (210) of the line through the rectangular opening (230) and remove the solder mask (220) remaining in the recess (214).

10. A method of operating a circuit board laser etching apparatus as claimed in claim 6, wherein the circuit surface (212a) of the circuit copper layer (210a) laser-etched by the third laser beam (L3) is curved or the circuit surface (212) of the circuit copper layer (210) laser-etched by the third laser beam (L3) is flush.

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