A laser and electrolytic assisted silicon carbide crystal ingot slicing equipment and silicon carbide crystal rod slicing method

TW202641656AInactive Publication Date: 2026-10-16林廷章
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Patent Information

Application Number
TW114112843
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-04-02
Publication Date
2026-10-16
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention relates to a slicing apparatus and a slicing method for conductive, nonconductive or semi-conductive materials of high hardness, in particular to a silicon carbide crystal ingot slicing apparatus and a slicing method for silicon carbide crystal rods.
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