Marking wheel and marking method
TW202641687APending Publication Date: 2026-10-16MITSUBOSHI DIAMOND IND CO LTD
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Patent Information
- Application Number
- TW115106984
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2026-01-23
- Filing Date
- 2026-02-26
- Publication Date
- 2026-10-16
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Abstract
The objective of this invention is to provide a scribing wheel and scribing method that can minimize peeling between the resin film and the brittle substrate when scribing a brittle substrate with a resin film attached, thereby forming a vertical crack in the brittle substrate. A preferred embodiment of the scribing wheel of this invention comprises: a body portion rotatable about an axis, including a peripheral end of the body portion and a pair of inclined surfaces defining the peripheral end of the body portion; a pair of shoulders, each including a peripheral end of the shoulder portion, i.e., a protrusion disposed from the body portion along the axis at a predetermined width; and a pair of grooves formed between the body portion and the pair of shoulders.
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