Multilayer, Method for Manufacturing Multilayer and Method for Manufacturing Semiconductor Devices

TW202641708APending Publication Date: 2026-10-16TORAY INDUSTRIES INC
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW115112508
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-02
Filing Date
2026-03-30
Publication Date
2026-10-16

Smart Images

  • Figure TWG2TA001081329_001
    Figure TWG2TA001081329_001
  • Figure TWG2TA001081329_002
    Figure TWG2TA001081329_002
  • Figure TWG2TA001081329_003
    Figure TWG2TA001081329_003
Patent Text Reader

Abstract

The present invention aims to provide a laminate that allows for the transfer of a pinned semiconductor wafer without damage and facilitates the removal of residue after transfer. The present invention is a laminate II formed by sequentially depositing a light-transmitting first support, a light-transmitting first resin film, and a pinned semiconductor wafer in a contact manner. The pinned semiconductor wafer includes a second support, a semiconductor wafer, and a second resin film, and is configured such that the light-transmitting first resin film is in contact with the second resin film.
Need to check novelty before this filing date? Find Prior Art