Epoxy resin composition, cured material, semiconductor device, and method for manufacturing semiconductor device

TW202641769APending Publication Date: 2026-10-16NAMICS CORPORATION
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Patent Information

Application Number
TW114145556
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-27
Filing Date
2025-11-21
Publication Date
2026-10-16

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Abstract

This invention provides an epoxy resin composition that can reduce bump joint defects. Furthermore, it provides a cured version of the above-mentioned epoxy resin composition, a semiconductor device having the cured version, and a method for manufacturing the semiconductor device. An epoxy resin composition comprises an epoxy resin (A), a curing agent (B), and an inorganic filler (C), wherein the inorganic filler (C) comprises an inorganic filler (CX) with a top cut diameter of 3.0 μm or less.
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