Radiosensitive linear components, patterning methods, and compounds
TW202641796APending Publication Date: 2026-10-16JSR CORPORATION
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Patent Information
- Application Number
- TW115110780
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-04-01
- Filing Date
- 2026-03-20
- Publication Date
- 2026-10-16
Abstract
The object of the present invention is to provide a radiosensitive linear composition, a patterning method and a compound that can fully exert sensitivity, CDU and development defect suppression at the level of pattern formation. A radiosensitive linear composition comprises: a compound (A) represented by the following formula (1); a polymer (B) comprising a structural unit (I) having an acid-dissociable group; and a solvent (S).
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