Compound, composition, and package structure

TW202641798APending Publication Date: 2026-10-16IND TECH RES INST

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Patent Information

Application Number: TW114112697
Authority / Receiving Office: TW · TW
Patent Type: Applications
Current Assignee / Owner
Filing Date: 2025-04-02
Publication Date: 2026-10-16

Application Information

Patent Timeline

02 Apr 2025

Application

TW114112697

16 Oct 2026

Publication

TW202641798A

IPC: C07C43/215; C08F212/12; C08F212/34; C08L25/16; C08L25/18; H10W74/10; H10W74/40

Inventors: 徐美玉; 林志浩

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Abstract

parts by weight. The compound A has a chemical structure of , wherein R is , and R' is , , or . The compound B has one or two terminal double bonds, and the compound C has three to six terminal double bonds. The compound A and the compound C have different chemical structures.

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Patent Information

Abstract