Resin composition, transfer film, cured material, laminate, manufacturing method of cured material, manufacturing method of laminate, manufacturing method of semiconductor device and semiconductor device

Abstract

The present invention aims to provide a resin composition, transfer film, cured material, laminate, method for manufacturing the cured material, method for manufacturing the laminate, method for manufacturing a semiconductor device, and semiconductor device capable of forming a cured material with excellent flatness and excellent adhesion and mechanical strength even after exposure to high temperature and high humidity environments. The resin composition of the present invention contains polyimide resin, a compound having a free radical polymerizable group, and a halogen element, wherein the halogen element content is 0.001 to 300 ppm relative to the total mass of the total solid components of the resin composition.

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