Hardened materials and electronic components

Abstract

[Problem] To provide a curable material that can suppress the curing resistance of polysiloxane resin. [Solution] A curable material is formed from a curable resin composition comprising: a carboxycarbamate resin, a phosphorus-containing photopolymerization initiator, an epoxy compound, and titanium dioxide; the elastic modulus G1 of the heat-treated curable material obtained by heat-treating it at 280°C for 5 minutes is determined by dynamic viscoelasticity measurement at 25°C; the elastic modulus G2 of the cleaned curable material obtained by immersing the heat-treated curable material in propylene glycol monomethyl ether at 25°C for 5 minutes and then drying it is determined by dynamic viscoelasticity measurement at 25°C, and the ratio G2 / G1 is 1.05 or more and 1.20 or less.