Low-dissipation polyimide, manufacturing method thereof, flexible copper clad laminate and manufacturing method of flexible copper clad laminate

Abstract

The present disclosure provides a low-dissipation polyimide, a manufacturing method thereof, a flexible copper clad laminate and a manufacturing method of the flexible copper clad laminate. The low-dissipation polyimide has a structure represented by formula (I), in which each symbol is as defined in the specification. The manufacturing method of the low-dissipation polyimide includes dissolving a first diamine monomer in an organic solvent to form a diamine monomer solution, adding a first di-anhydride monomer into the diamine monomer solution to form a polyamic acid solution, and performing a ring-closing reaction by heating the polyamic acid solution to form the low-dissipation polyimide. Therefore, the dielectric dissipation of the low-dissipation polyimide can be reduced, and it is favorable for being applied to printed circuit boards with a high frequency transmission.

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