Resin sheet for sealing hollow electronic component and hollow electronic component

TW202641915APending Publication Date: 2026-10-16TOYO INK MFG CO LTD +1
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Patent Information

Application Number
TW114150059
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-04
Filing Date
2025-12-19
Publication Date
2026-10-16

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Abstract

This invention provides a resin sheet for sealing hollow electronic components that combines excellent flexibility and low thermal expansion, and a hollow electronic component using the resin sheet. The resin sheet for sealing hollow electronic components forms a sealing layer for the hollow electronic component. The resin sheet is a resin composition comprising a thermosetting resin (A), a polyfunctional maleimide compound having two or more maleimide groups (B), a benzoxazine compound (C), and an epoxy resin (D).
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