Manufacturing methods for curable resin compositions, temporary fixing materials, and electronic components.

Abstract

The object of this invention is to provide a curable resin composition that, even when subjected to high-temperature processing at 300°C or above while the adhesive and support are fixed together, can suppress the formation of voids and bulges between them, and can be easily peeled off after high-temperature processing. Furthermore, the object of this invention is to provide a temporary fixing material having an adhesive layer composed of the curable resin composition, and a method for manufacturing electronic components using the temporary fixing material. This invention is a curable resin composition comprising: a reactive compound (1) having maleic diamide groups, and a resin (2) having an amide backbone in the repeating units of the main chain. none