Organopolysiloxane composition, low dielectric constant polymer film, semiconductor device, optical element and optoelectrical device comprising the same, and methods using the same
TW202641925APending Publication Date: 2026-10-16PIBOND OY
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Patent Information
- Application Number
- TW114148220
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-30
- Filing Date
- 2025-12-09
- Publication Date
- 2026-10-16
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Abstract
The present invention relates to low dielectric constant films comprising polymerized organopolysiloxane material obtained by polymerization of organo functionalized monomers. The invention also concerns a method of forming such films by applying organopolysiloxane material containing compositions on a substrate in the form of a layer and by curing the layer to form a film. Further, the invention concerns uses of the low dielectric constant films of the invention in semiconductor devices, optical elements and optoelectronic devices.
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