Chemical mechanical polishing slurry
TW202641939APending Publication Date: 2026-10-16ANJI MICROELECTRONICS TECH (SHANGHAI) CO LTD
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Patent Information
- Application Number
- TW114150291
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-31
- Filing Date
- 2025-12-19
- Publication Date
- 2026-10-16
Abstract
The invention provides a chemical mechanical polishing slurry comprising: abrasive and organic phosphonic acid compounds. The slurry with the addition of organic phosphonic acid compounds has a low removal rate of phenolic resin-based hard masks and a high selectivity of SiO2to hard mask which can stop on the phenolic resin-based hard mask material.
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