Chemical mechanical polishing slurry

TW202641940APending Publication Date: 2026-10-16ANJI MICROELECTRONICS TECH (SHANGHAI) CO LTD
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Patent Information

Application Number
TW114150448
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-31
Filing Date
2025-12-22
Publication Date
2026-10-16

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Abstract

The invention provides a chemical mechanical polishing slurry for polyimide (PI) materials. The slurry uses alumina abrasive particles by adjusting the pH, which can achieve high PI removal rate while reducing PI surface roughness after polishing.
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