Sputtering target bonding method and target assemblies produced thereby

Abstract

A method of forming a bond in a sputtering assembly includes forming first projections on a bonding surface of a sputtering target, forming second recesses on a bonding surface of a backing plate, aligning the sputtering target and the backing plate so that the first projections fit within the second recesses and the second projections fit within the first recesses to form an assembly, and applying pressure to the assembly so that first projections form an interlock bond between the sputtering target and the backing plate, wherein the interlock bond is void-free and wherein the backing plate having a greater hardness than the sputtering target.

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