Dynamic vacuum seal system for physical vapor deposition sputter applications
TW202641992APending Publication Date: 2026-10-16TOSOH SMD INC
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Patent Information
- Application Number
- TW115126635
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2022-07-08
- Filing Date
- 2023-07-10
- Publication Date
- 2026-10-16
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Figure TWG2TA001081449_001 
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Abstract
Provided is a vacuum seal and seal system including a corresponding isolation ring and a corresponding sputtering target. The seal and seal system may be used in PVD sputter applications. In an embodiment, the seal and seal system does not incorporate an O-ring and corresponding groove or any vent slots or scallops. The seal may include a compressible portion and a rigid portion. The compressible portion may include two or more higher profile protrusions and two or more lower profile recesses that facilitate formation of a vacuum seal through compression by and between the isolation ring and the sputtering target. The rigid portion may have a rib be encapsulated by the same material as the compressible portion. The seal may further include a removable and replaceable plasma shield that is attachable to a first end of the seal. The seal may further include a rim on a second end that selectively couples with a corresponding step-out portion of the isolation ring. The sputtering target may have a continuous peripheral flange surface. In an embodiment, the seal and seal system is self-centering. In an embodiment, the seal and seal system provides a seal. In an embodiment, the seal and seal system provides an increased sealing surface or interface. In an embodiment, the seal and seal system provides a buffer between the sputtering target and the isolation ring.
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