Interlock arrangements, semiconductor processing systems including interlock arrangements, interlock kits, and related methods of interlocking fluid sources

TW202642003APending Publication Date: 2026-10-16ASM IP HLDG BV
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Patent Information

Application Number
TW114149022
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-18
Filing Date
2025-12-15
Publication Date
2026-10-16

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Abstract

An interlock arrangement includes a signal lead, a first mechanical switch, and a second mechanical switch. The signal lead has a first end and a second end. The first mechanical switch is coupled to the first end of the signal lead and has a normally-closed position and an open position. The second mechanical switch couples the first mechanical switch to the second end of the signal lead and has a normally-open position and a closed position. Semiconductor processing systems and methods including and / or performed at the interlock arrangement are also described.
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