Anisotropic conductive components and joints

TW202642016APending Publication Date: 2026-10-16FUJIFILM CORP
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Patent Information

Application Number
TW115109585
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-27
Filing Date
2026-03-16
Publication Date
2026-10-16

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Abstract

This invention provides an anisotropic conductive member and a bonding body that are easy to align. A bonding body comprises: an anisotropic conductive member having an insulating film and a plurality of conductors, the insulating film being electrically insulating, the plurality of conductors being through-thickness and electrically insulating from each other; and a bonding member, which is bonded to the anisotropic conductive member. The anisotropic conductive member has a recess on at least one side of the insulating film, and the bonding member has a protrusion located opposite the recess of the anisotropic conductive member, the recess of the anisotropic conductive member engaging with the protrusion of the bonding member.
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