Heat-dissipating substrate and its manufacturing method

Abstract

This invention provides a technique for improving the heat dissipation performance of a heat-dissipating substrate comprising diamond particles and a metal substrate. The heat-dissipating substrate 100 is plate-shaped with a thickness of 100 μm to 1000 μm and includes a plurality of diamond particles 10 and a metal substrate 20 for fixing the diamond particles 10. The metal substrate 20 has a first surface 21 and a second surface 22 opposite to the first surface 21. Based on SEM images of a cross-section along the thickness direction, the ratio (T1 / D1) of the average thickness T1 of the metal substrate 20 between the first surface 21 and the second surface 22, and the average shortest distance D1 between the first end 11 on the first surface 21 side and the second end 12 on the second surface 22 side of the diamond particles is 0.6 to 1.1.

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