Fiber bundling agents, fiber bundles, molding materials and molded articles
TW202642034APending Publication Date: 2026-10-16DIC CORP
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Patent Information
- Application Number
- TW114147870
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-24
- Filing Date
- 2025-12-08
- Publication Date
- 2026-10-16
Abstract
The present invention aims to provide a fiber bridging agent that exhibits excellent storage stability and bridging properties, generates minimal thermal decomposition gases during molding, and contributes to the resistance of molded articles to yellowing. The solution of the present invention utilizes a fiber bridging agent comprising an aqueous urethane resin composition containing an urethane resin and an aqueous medium. The urethane resin is characterized by using a polyol compound, a diisocyanate compound, a compound containing a nonionic group, and a hydrazine derivative having an active hydrogen atom as essential raw materials. The polyol compound comprises a polyester polyol; the diisocyanate compound comprises an aliphatic diisocyanate compound and / or an alicyclic diisocyanate compound; the compound containing the nonionic group comprises polyoxyethylene monomethyl ether and / or polyethylene glycol; and the content of the compound containing the nonionic group in the raw materials of the urethane resin is in the range of 3-10% by mass.
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