Thermal conductive module and electronic device having the same

Abstract

An electronic device comprises a thermal conductive module and a heat dissipation module. The thermal conductive module comprises a vapor chamber and a plurality of heat pipes. The vapor chamber comprises a hollow casing and a plurality of capillary structures. The hollow casing comprises a first outer surface and a second outer surface, wherein the first outer surface is adapted to contact a temperature-controlled element. The plurality of capillary structures are disposed within the hollow casing. The heat pipes are disposed on the second outer surface of the hollow casing and respectively correspond to the plurality of capillary structures. The hollow casing comprises a heat source region corresponds to the temperature-controlled component. A maximum heat transfer capacity in the heat source region is lower than a maximum heat transfer capacity in a region outside the heat source region. The heat dissipation module is connected to the plurality of heat pipes of the thermal conductive module.

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