Cooling water block assembly

Abstract

A cooling water block assembly includes a heat exchange base, a first heat sink, a second heat sink, and a cooling wafer. The heat exchange base forms a heat exchange chamber and two connecting units. The first heat sink forms a liquid inlet chamber, a liquid inlet unit communicating with the liquid inlet chamber, and a liquid supply unit communicating with the liquid inlet chamber and one of the two connecting units. The second heat sink is stacked with the heat exchange base and the first heat sink, and forms a liquid return chamber, a liquid return unit communicating with the heat exchange chamber and the liquid return chamber, and a liquid outlet unit communicating with the liquid return chamber. The cooling wafer is disposed between the first heat sink and the second heat sink, with a cold end and a hot end of the cooling wafer contacting the first heat sink and the second heat sink respectively, forming a heat exchange relationship.

Description

[Technical Field]

[0001] This invention relates to a heat dissipation water cooling head assembly, and more particularly to a heat dissipation water cooling head assembly with a cooling chip. [Previous Technology]

[0002] Regarding the water-cooled heat dissipation systems disclosed in currently published patents, such as TW M295424, TW M656395, CN 111045502A, and TW M252992, the system includes a heat exchange structure, an electro-cooling unit connected to the heat exchange structure, and a water-cooling head connected to the electro-cooling unit. The heat exchange structure can be a water-cooling radiator, and the electro-cooling unit has a cooling chip. In practice, the water-cooled heat dissipation system connects the water-cooling head to a heat source, receives heat energy from the heat source, and then exchanges heat with the heat source through a heat exchange fluid, thereby achieving a heat dissipation effect. Simultaneously, the heat exchange fluid, having acquired temperature after heat exchange with the heat source, returns to the heat exchange structure and the electro-cooling unit to lower its temperature, allowing it to dissipate heat from the heat source again.

[0003] However, the water-cooled heat dissipation system implemented in the previous patent is bulky and the water line design is too complex, resulting in a large installation space required when the front-opening water-cooled heat dissipation system is used with a heat source. In addition, the current water-cooled heat dissipation system is mainly used in electronic products, such as computer mainframes. The internal space of the aforementioned electronic products is limited, and they pursue a streamlined and neat internal configuration, which makes it difficult for the front-opening water-cooled heat dissipation system to meet the requirements.

[0004] Furthermore, although the electrocooling unit of the aforementioned water-cooled heat dissipation system has the function of heat exchange for the heat exchange fluid, in reality, after the heat exchange fluid with temperature flows out of the heat exchange unit, it will first enter the heat exchange structure for heat exchange before flowing into the electrocooling unit. In other words, the electrocooling unit can only provide a function of further cooling the heat exchange fluid. [Summary of the Invention]

[0005] The main objective of this invention is to solve the problem of conventional water-cooled heat dissipation systems being bulky and having complex water line designs.

[0006] Another object of the present invention is to solve the problem that the electrocooling unit of conventional water-cooled heat dissipation system can only provide a further cooling function for the heat dissipation liquid.

[0007] To achieve the above objectives, the present invention provides a water-cooling head assembly, comprising a heat exchange base, a first heat sink, a second heat sink, and a cooling wafer. The heat exchange base is formed with a heat exchange chamber and two connecting units connecting the heat exchange chamber, and the heat exchange base contacts a component to be cooled. The first heat sink is formed with a liquid inlet chamber, a liquid inlet unit communicating with the liquid inlet chamber, and a liquid supply unit communicating with the liquid inlet chamber and communicating with one of the two connecting units. The second heat sink is stacked with the heat exchange base and the first heat sink, and the second heat sink is formed with a liquid return chamber, a liquid return unit communicating with the heat exchange chamber and the liquid return chamber, and a liquid outlet unit communicating with the liquid return chamber. The cooling chip is disposed between the first heat sink and the second heat sink. The first heat sink, the cooling chip, the second heat sink and the heat exchange base are sequentially fitted together to form a modular structure. A cold end and a hot end of the cooling chip respectively contact the first heat sink and the second heat sink and form a heat exchange relationship.

[0008] In one embodiment, the cooling water head assembly is provided with at least two fin groups respectively disposed in the liquid inlet chamber and the liquid return chamber.

[0009] In one embodiment, the first heat sink includes two first components that together form the liquid inlet chamber, the heat sink assembly has at least one first water-blocking ring disposed between the two first components, the second heat sink includes two second components that together form the liquid return chamber, and the heat sink assembly has at least one second water-blocking ring disposed between the two second components.

[0010] In one embodiment, the liquid supply unit and the liquid return unit are at least one connector and at least one conduit connected to the connector.

[0011] In one embodiment, the heat exchange base includes a base body and a heat sink connected to the base body and in contact with the heat dissipation component, the base body and the heat sink together defining the heat exchange chamber.

[0012] In one embodiment, the seat body is formed with a flow guiding structure disposed in the heat exchange chamber, the flow guiding structure defining at least one flow guiding channel in the heat exchange chamber.

[0013] In one embodiment, the heat exchange base has a flow guide plate disposed between the base body and the heat sink, and the flow guide plate has a notch located on the at least one flow guide channel.

[0014] As disclosed in the foregoing invention, compared with conventional technology, the present invention has the following features: the heat exchange base, the first heat sink, the second heat sink and the cooling chip of the present invention are implemented in the form of a structural assembly, so that the heat dissipation water cooling head assembly has the features of simplified structure and simple water line design.

Implementation Method

[0015] The detailed description and technical content of this invention are explained below with reference to the drawings:

[0016] Please refer to Figures 1 to 8. The present invention provides a heat dissipation water cooling head assembly 20, including a heat exchange base 21, a first heat sink 23, a second heat sink 25, and a heat sink 27. The heat exchange base 21 contacts a component to be cooled and receives heat energy from the component. The heat exchange base 21 forms a heat exchange chamber 211 and two connecting units 212 and 213. The heat exchange chamber 211 serves as the place where the heat exchange base 21 and the component to be cooled perform heat exchange. The two connecting units 212 and 213 communicate with the heat exchange chamber 211 and provide a connection between the heat exchange base 21 and the first heat sink 23 and the second heat sink 25. The first heat sink 23 is formed with a liquid inlet chamber 231, a liquid inlet unit 232 and a liquid supply unit 233. The liquid inlet chamber 231 allows liquid to flow into it. The liquid inlet unit 232 is connected to the liquid inlet chamber 231 and serves as the pre-inlet stage of the liquid inlet chamber 231, so that the liquid flows from the liquid inlet unit 232 into the liquid inlet chamber 231. The liquid supply unit 233 is connected to the liquid inlet chamber 231 and is connected to one of the two connecting units 212 and 213 of the heat exchange base 21. The liquid supply unit 233 serves as the post-outlet stage of the liquid inlet chamber 231 and as the pre-inlet stage of the heat exchange base 21. The liquid supply unit 233 receives the liquid from the liquid inlet chamber 231 and allows the liquid to flow into one of the two connecting units 212. The second heat sink 25 is stacked with the heat exchange base 21 and the first heat sink 23. The second heat sink 25 is formed with a return liquid chamber 251, a return liquid unit 252 and a liquid outlet unit 253. The return liquid unit 252 is connected to the return liquid chamber 251 and is connected to the other of the two connecting units 213 of the heat exchange base 21. The return liquid unit 252 serves as the water outlet stage of the heat exchange base 21. The return liquid unit 252 receives the liquid from the heat exchange base 21 through the other of the two connecting units 213 and allows the liquid to flow into the return liquid chamber 251. The liquid outlet unit 253 is connected to the return liquid chamber 251. The liquid outlet unit 253 serves as the water outlet stage of the return liquid chamber 251 and receives the liquid from the return liquid chamber 251. Furthermore, the cooling chip 27 is disposed between the first heat sink 23 and the second heat sink 25. The cooling chip 27 is a semiconductor device that mainly utilizes the Peltier effect of semiconductor materials. The cooling chip 27 has at least one electric field line 271. When current passes through the cooling chip 27 via the at least one electric field line 271, the two ends of the cooling chip 27 can absorb heat and release heat respectively, thereby achieving an active cooling effect. Furthermore, those skilled in the art refer to the end of the cooling chip 27 used to absorb heat as a cold end 272, and the end of the cooling chip 27 used to release heat as a hot end 273.It should be further clarified that the cold end 272 and the hot end 273 are not geographically endpoints of the cooling chip 27, but rather refer to two relative positions of the cooling chip 27 that provide different thermodynamic functions. In this invention, the cold end 272 and the hot end 273 of the cooling chip 27 respectively contact the first heat sink 23 and the second heat sink 25, and form a heat exchange relationship with the first heat sink 23 and the second heat sink 25.

[0017] Referring again to Figures 1 to 10, the cooling water head assembly 20 of the present invention uses a heat exchange fluid 90 as the heat exchange medium during operation. The heat exchange fluid 90 is the liquid mentioned above, which can be water, ethanol, etc. The cooling water head assembly 20 uses the liquid inlet unit 232 and the liquid outlet unit 253 as the connection points with the outside. That is to say, the cooling water head assembly 20 receives the heat exchange fluid 90 through the liquid inlet unit 232 and discharges the heat exchange fluid 90 through the liquid outlet unit 253.

[0018] Assume that the first heat sink 23 of the present invention contacts the cold end 272 of the cooling chip 27, and the second heat sink 25 contacts the hot end 273 of the cooling chip 27. The cooling head assembly 20 receives the heat sink 90 through the liquid inlet unit 232. The heat sink 90 flows into the liquid inlet chamber 231 and is cooled by the cold end 272 of the cooling chip 27. Then, it flows into the heat exchange chamber 211 through the liquid supply unit 233 and one of the two connecting units 213. At this time, since the heat exchange base 21 carries the heat energy from the heat-dissipating component, the low-temperature heat sink 90 contacts the heat exchange base 21 and exchanges heat with it, thereby achieving the purpose of heat exchange with the heat-dissipating component. The heat sink 90 becomes warm due to absorbing heat energy. Next, the coolant 90 flows out from the other 212 of the two connecting units and flows into the return chamber 251 through the return unit 252. At this time, although the coolant 90 is warm, it can still perform appropriate heat exchange on the second heat sink 25, and finally it is discharged from the cooling head assembly 20 by the supply unit 233.

[0019] Referring again to Figures 4 to 10, the cooling water head assembly 20 of the present invention can be combined with a heat exchange structure to form a heat dissipation system 100. The heat exchange structure can be an air cooling device or a water cooling device 40. Taking the water cooling device 40 illustrated herein as an example, the cooling water head assembly 20 is connected to the water cooling device 40 via the liquid inlet unit 232 and the liquid outlet unit 253. The liquid inlet unit 232 of the cooling water head assembly 20 serves as the water outlet stage of the water cooling device 40, and the liquid outlet unit 253 serves as the water inlet stage of the water cooling device 40. In practice, the heat dissipation liquid 90 with temperature is discharged from the liquid outlet unit 253 and flows into the water cooling device 40 for heat exchange, and then flows back into the cooling water head assembly 20 via the liquid inlet unit 232. In this invention, the heat dissipation system 100 further includes a water pump 50 disposed between the water cooling device 40 and the water cooling head assembly 20. The water pump 50 may be disposed on the water cooling device 40 or on the pipeline between the water cooling device 40 and the water cooling head assembly 20. When the water pump 50 is started, it continuously draws the heat dissipation fluid 90, thereby forming a circulation loop between the water cooling head assembly 20 and the water cooling device 40, allowing the heat dissipation fluid 90 to continuously provide a heat dissipation effect.

[0020] As described above, the cooling water block assembly 20 of the present invention includes the cooling chip 27, with the cold end 272 and the hot end 273 of the cooling chip 27 contacting the first heat sink 23 and the second heat sink 25 respectively to provide heat dissipation. Simultaneously, the first heat sink 23, the cooling chip 27, the second heat sink 25, and the heat exchange base 21 are sequentially fitted together to form a modular structure. The present invention is implemented in a modular assembly manner, giving it the characteristics of simplified structure and simple waterline design. Furthermore, through the water channel design configured in the cooling water block assembly 20 of the present invention, when the cooling water block assembly 20 is implemented in the heat dissipation system 100, in addition to providing heat exchange for the component to be cooled, it can also provide a suitable heat dissipation effect for the cooling chip 27.

[0021] Referring again to Figures 1 to 10, to simplify the water lines of the cooling water block assembly 20, in one embodiment, the liquid supply unit 233, the liquid return unit 252, and the two connecting units 212 and 213 are all located on the same side of the cooling water block assembly 20. Furthermore, the liquid supply unit 233 and the liquid return unit 252 can be formed by the structure of either the first heat sink 23 or the second heat sink 25, or they can be formed by an external structure. In detail, the liquid supply unit 233 and the liquid return unit 252 consist of at least one connector 234, 254 and at least one conduit 235, 255. The at least one connector 234, 254 is disposed on one of the first heat sink 23 and the second heat sink 25. The at least one conduit 235, 255 is connected to the at least one connector 234, 254 and is connected to one of the two connecting units 212, 213. Thus, the present invention can avoid the problem of complex wiring of multiple conduits 235, 255 in the cooling head assembly 20. In another embodiment, the liquid inlet unit 232 and the liquid outlet unit 253 are located on the same side of the cooling head assembly 20, but not on the same side as the liquid supply unit 233, the liquid return unit 252 and the two connecting units 212, 213. The liquid inlet unit 232 and the liquid outlet unit 253 are each connected by at least one connector 236, 256 and at least one connecting pipe 237, 257. The at least one connector 236, 256 is disposed on one of the first heat sink 23 and the second heat sink 25. The at least one connecting pipe 237, 257 is connected to the at least one connector 236, 256 and can be connected to the water cooling device 40.

[0022] On the other hand, in order to improve heat exchange efficiency, in one embodiment of the present invention, the heat dissipation water cooling head assembly 20 is provided with at least two fin groups 28, the at least two fin groups 28 are respectively provided in the liquid inlet chamber 231 and the liquid return chamber 251, each of the at least two fin groups 28 includes a plurality of spaced fins 281, and the fins 281 increase the contact area with the heat dissipation liquid 90.

[0023] Referring again to Figures 2 to 6, in one embodiment, the first heat sink 23 includes two first components 238, which together form the liquid inlet chamber 231. The two first components 238 are connected to at least one first assembly structure 239 and at least one first assembly groove 240, and one of the two first components 238 is provided with one of the at least two fin groups 28 disposed thereon. The second heat sink 25 includes two second components 258, which together form the second component 258 of the liquid return chamber 251. The two second components 258 are connected to at least one second assembly structure 259 and at least one second assembly groove 260, and one of the two second components 258 is provided with the other of the at least two fin groups 28 disposed thereon.

[0024] Furthermore, in order to improve the airtightness of the two first components 238 and the two second components 258, in one embodiment, the heat dissipation water cooling head assembly 20 includes at least one first water-blocking ring 29 and at least one second water-blocking ring 30. The at least one first water-blocking ring 29 is disposed between the two first components 238, and the at least one second water-blocking ring 30 is disposed between the two second components 258. The at least one first water-blocking ring 29 and the at least one second water-blocking ring 30 are compressed to prevent the heat dissipation liquid 90 from flowing out from the gap between the two first components 238 or the two second components 258.

[0025] Additionally, please refer to Figures 2 to 10. In one embodiment, the heat exchange base 21 of the present invention includes a body 214 and a heat sink 215. The heat sink 215 contacts the component to be cooled, and the base body 214 and the heat sink 215 together define the heat exchange chamber 211. Furthermore, to guide the flow of the heat dissipation fluid 90, in one embodiment, the base body 214 is formed with a flow guiding structure 216. The flow guiding structure 216 is located within the heat exchange chamber 211, and the heat exchange chamber 211 defines at least one flow guiding channel 217 connecting the two connecting units 212 and 213. In another embodiment, the heat exchange base 21 further includes a flow guiding plate 218, which is located between the base body 214 and the heat sink 215. The flow guiding plate 218 has a notch 219 located on the at least one flow guiding channel 217. More specifically, the at least one flow channel 217 is divided by the notch 219 into a water intake portion 220 connecting one of the two connecting units 212 and a drainage portion 221 connecting the other of the two connecting units 213. The water intake portion 220 faces the notch 219 and receives the heat dissipation liquid 90 from one of the two connecting units 212. The heat dissipation liquid 90 is guided by the at least one flow structure 216 to flow towards the notch 219 of the flow guide plate 218. The drainage portion 221 receives the heat dissipation liquid 90 from the notch 219 and allows the heat dissipation liquid 90 to flow back to the other of the two connecting units 213 along the periphery of the flow guide plate 218 through the gap between the flow guide plate 218 and the heat sink 215.

[0026] On another aspect, in order to assemble the heat exchange base 21 and the heat dissipation component, in one embodiment, the heat exchange base 21 has a mounting plate 222 disposed on the base body 214. Furthermore, to stabilize the stacked design of the heat exchange base 21, the first heat sink 23, and the second heat sink 25, in one embodiment, the heat exchange base 21 includes a cap 223 disposed on the base body 214, the cap 223 connecting one of the first heat sink 23 and the second heat sink 25. In yet another embodiment, the first heat sink 23 and the second heat sink 25 are provided with at least one opening 261 and at least one connecting structure 241, the at least one connecting structure 241 being disposed within the at least one opening 261 to position the assembly position of the first heat sink 23 and the second heat sink 25. [Simplified Explanation of the Diagram]

[0027] Figure 1 is a three-dimensional structural schematic diagram of an embodiment of the present invention. Figure 2 is an exploded schematic diagram (I) of an embodiment of the present invention. Figure 3 is an exploded schematic diagram (II) of an embodiment of the present invention. Figure 4 is an exploded schematic diagram (III) of an embodiment of the present invention. Figure 5 is an exploded schematic diagram (IV) of an embodiment of the present invention. Figure 6 is a cross-sectional schematic diagram of line segment AA in Figure 1. Figure 7 is a cross-sectional schematic diagram of line segment BB in Figure 6. Figure 8 is a cross-sectional schematic diagram of line segment CC in Figure 6. Figure 9 is a cross-sectional schematic diagram of line segment DD in Figure 7. Figure 10 is an implementation schematic diagram of the present invention with a water-cooling device.

Claims

1. A water cooling head assembly, comprising: a heat exchange base having a heat exchange chamber and two connecting units connecting the heat exchange chamber, the heat exchange base contacting a component to be cooled; a first heat sink having a liquid inlet chamber, a liquid inlet unit communicating with the liquid inlet chamber and a liquid supply unit communicating with the liquid inlet chamber and communicating with one of the two connecting units; a second heat sink being stacked with the heat exchange base and the first heat sink, the second heat sink having a liquid return chamber, a liquid return unit communicating with the heat exchange chamber and the liquid return chamber, and a liquid outlet unit communicating with the liquid return chamber; and a cooling chip disposed between the first heat sink and the second heat sink, the first heat sink, the cooling chip, the second heat sink and the heat exchange base being sequentially fitted together to form a modular structure, a cold end and a hot end of the cooling chip respectively contacting the first heat sink and the second heat sink and forming a heat exchange relationship.

2. The water cooling block assembly as described in claim 1, wherein, The cooling water block assembly is provided with at least two fin groups respectively located in the liquid inlet chamber and the liquid return chamber.

3. The water cooling block assembly as described in claim 2, wherein, The first heat sink includes two first components that together form the liquid inlet chamber. The heat sink assembly has at least one first water-blocking ring disposed between the two first components. The second heat sink includes two second components that together form the liquid return chamber. The heat sink assembly has at least one second water-blocking ring disposed between the two second components.

4. The water cooling block assembly as described in any one of claims 1 to 3, wherein, The liquid supply unit and the liquid return unit each consist of at least one connector and at least one conduit connected to the connector.

5. The water cooling block assembly as described in any one of claims 1 to 3, wherein, The heat exchange base includes a main body and a heat sink connected to the main body and in contact with the component to be scald. The main body and the heat sink together define the heat exchange chamber.

6. The water cooling block assembly as described in claim 5, wherein, The main body of the seat is formed with a flow guiding structure disposed in the heat exchange chamber, which defines at least one flow guiding channel in the heat exchange chamber.

7. The water cooling block assembly as described in claim 6, wherein, The heat exchange base has a flow guide plate disposed between the base body and the heat sink, and the flow guide plate has a notch located on the at least one flow guide channel.

Images