Surface shape measurement methods and surface shape measurement systems

TW202642142APending Publication Date: 2026-10-16MITSUBISHI HEAVY IND LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW115102531
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-21
Filing Date
2026-01-22
Publication Date
2026-10-16

Smart Images

  • Figure TWG2TA001081007_001
    Figure TWG2TA001081007_001
  • Figure TWG2TA001081007_002
    Figure TWG2TA001081007_002
  • Figure TWG2TA001081007_003
    Figure TWG2TA001081007_003
Patent Text Reader

Abstract

To provide a surface shape measurement method, when the measurement object is any machine from a storage section of stored raw material to a utilization section where the raw material is pulverized into powder via a pulverizer, the surface shape can be measured in a low-cost and convenient manner. The surface shape measurement method, which measures the shape of the surface in contact with the raw material and / or the powder via any machine from a storage section of stored raw material to a utilization section where the powder is pulverized, includes the steps of: attaching the powder to the surface of the measurement object; and irradiating the measurement object with light to perform optical three-dimensional measurement.
Need to check novelty before this filing date? Find Prior Art