Electro-conductive contact pin and electro-conductive contact pin array

TW202642170APending Publication Date: 2026-10-16POINT ENG
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Patent Information

Application Number
TW115113228
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-10
Filing Date
2026-04-02
Publication Date
2026-10-16

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Abstract

The present invention provides an electro-conductive contact pin and electro-conductive contact pin array capable of adapting to narrow pitches in semiconductor packaging by translating upper and lower pitches. Furthermore, it enhances current-carrying capacity by increasing the current path area. Moreover, the deformation remains minimal even when subjected to repeated contact loads, thereby exhibiting high mechanical strength.
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