Chuck structure and semiconductor test method using the same

TW202642178APending Publication Date: 2026-10-16SEMICS INC
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Patent Information

Application Number
TW114145006
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-07-21
Filing Date
2025-11-18
Publication Date
2026-10-16

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Abstract

The present invention discloses a chuck structure and a semiconductor test method using the same. The chuck structure according to this technology includes: a thin film having a plurality of dies disposed thereon; and a chuck having the thin film disposed on one surface, and having a plurality of grooves formed on said one surface to adsorb the thin film.
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