Apparatus for die level testing with area-specific vacuum pressure forming structure for mobile chuck moving

Abstract

This invention discloses a multi-wafer-level testing apparatus, comprising: a carrier surface for placing wafers, and a movable chuck with a plurality of vacuum adsorption holes for adsorbing the wafers onto the carrier surface; a chuck base disposed below the movable chuck to support the movable chuck; a vacuum forming section connected to the vacuum adsorption holes to form a vacuum pressure; a switching valve disposed in a vacuum flow path connecting the vacuum adsorption holes and the vacuum forming section; and a controller for controlling the operation of the vacuum forming section and the switching valve.

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