Die chuck with vapor chamber

TW202642183APending Publication Date: 2026-10-16SEMICS INC
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Patent Information

Application Number
TW114152215
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-07-15
Filing Date
2025-12-31
Publication Date
2026-10-16

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Abstract

According to one aspect of the present invention, a die chuck with a vapor chamber includes: a movable chuck for carrying a plurality of dies cut from a wafer; and a chuck base for mounting the movable chuck; wherein the movable chuck may include: a plurality of vacuum adsorption holes formed on one side to allow the plurality of dies to be fixed by vacuum adsorption; and a vapor chamber for diffusing and transferring heat generated by the dies disposed on the one side to the chuck base, or for diffusing and transferring heat generated by the chuck base to the dies disposed on the one side.
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