Apparatus for die level testing with vacuum pressure forming structure for mobile chuck moving

Abstract

This invention discloses a grain-level testing apparatus having a vacuum pressure forming structure for moving a movable chuck. According to one aspect of the invention, the grain-level testing apparatus may include: a movable chuck having a mounting surface for placing grains and a plurality of vacuum suction holes for adsorbing the grains onto the mounting surface; a chuck base disposed below the movable chuck to support it; a chuck handle supporting the lower surface of the movable chuck to enable its movement; a vacuum forming section connected to the vacuum suction holes to form a vacuum pressure; and a controller for controlling the operation of the vacuum forming section.

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